Abstract: PCB manufacturing, printed circuit board assembly, PCB soldering technology. In principle, conventional inserts can also be reflowed, often referred to as through-hole reflow. What is the principle of PCB soldering technology? Next, follow FS Technology to learn all about this knowledge.

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The principle of circuit board soldering technology 1. Warm up Solvents that increase the viscosity and screen printing properties required for pcbs are required. When starting to evaporate, be sure to control the temperature so that the temperature rise must be slow (about 5°C per second) to limit boiling and splashing and prevent the formation of small tin beads. Additionally, some components are sensitive to internal stress. FS Tech believes that the external temperature of the module rises too fast, which will lead to cracking. This is the experience of FS PCB in the past, and beginners must keep in mind.

The chemical cleaning operation begins. Water-soluble flux (paste) and non-cleaning flux (paste) have the same cleaning action, but the temperature of the two is slightly different. Removes metal oxides and some contaminants from the metal and solder particles to be bonded. A good metallurgical solder joint requires a "clean" surface.

As the temperature continues to rise, the solder particles first melt individually and begin a "rapid" process of liquefaction and surface tin extraction. This covers all possible surfaces and begins to form solder joints.

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1. Reflow FS PCBA believes that this is the most important stage. When all the individual solder particles melt, they combine to form liquid tin. At this point, surface tension begins to build up on the surface of the pin. If the gap between component pins and PCB pads exceeds 4mil (1mil = one thousandth of an inch), the pins and pads are likely to separate due to surface tension, which will result in solder joints.

2. Cool down In the cooling stage, if the cooling speed is fast, the strength of the tin point will be slightly larger, but not too fast, otherwise it will cause temperature stress inside the component.

The above is FS Tech's insights on pcb welding technology. We will publish an article on testing pcb welding quality later, so stay tuned!